JPS61125071U - - Google Patents
Info
- Publication number
- JPS61125071U JPS61125071U JP820485U JP820485U JPS61125071U JP S61125071 U JPS61125071 U JP S61125071U JP 820485 U JP820485 U JP 820485U JP 820485 U JP820485 U JP 820485U JP S61125071 U JPS61125071 U JP S61125071U
- Authority
- JP
- Japan
- Prior art keywords
- divided
- printed circuit
- clad laminate
- solder resist
- resist portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 6
- 230000004927 fusion Effects 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP820485U JPS61125071U (en]) | 1985-01-24 | 1985-01-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP820485U JPS61125071U (en]) | 1985-01-24 | 1985-01-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61125071U true JPS61125071U (en]) | 1986-08-06 |
Family
ID=30487275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP820485U Pending JPS61125071U (en]) | 1985-01-24 | 1985-01-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61125071U (en]) |
-
1985
- 1985-01-24 JP JP820485U patent/JPS61125071U/ja active Pending